Numerical Simulation of Slip Resistance of Shoe Sole Tread Patterns Using Finite Element Method
DOI:
https://doi.org/10.38032/scse.2025.3.127Keywords:
Finite Element Analysis, Footwear outsole, Tread pattern, Slip resistance, Soling materialAbstract
Multiple factors can cause slips and falls, leading to long-term musculoskeletal injuries. Slip resistance can be achieved mainly by wearing footwear soles with better gripping materials and tread patterns. However, it is necessary to analyze the impact of a complex tread pattern design on slip resistance compared with a simpler outsole tread design. This study aims to assess the slip resistance of shoe outsoles with varied tread patterns and materials on soil and steel surfaces through finite element analysis. In this study, detailed geometric models of six tread patterns were developed using SolidWorks software. Ethylene-vinyl acetate (EVA), polyurethane (PU), thermoplastic rubber (TPR), and polyvinyl chloride (PVC) were used as the outsole materials, and the soil and steel surfaces were considered as ground surfaces. The simulations were performed using Ansys software by applying realistic boundary conditions to analyze the slip resistance performance of the outsoles through displacement analysis. The modeling and simulation process investigated the influence of tread patterns, material properties, and surface characteristics on slip resistance. The simulation results showed that complex tread patterns have higher slip resistance than simpler designs. In the case of soling materials, EVA outperformed PU, PVC, and TPR on both steel and soil surfaces, suggesting that it is the most effective material for slip resistance. PVC had the lowest slip resistance, while PU and TPR had almost the same results. The simulation outcomes provide valuable insights into the parameters that influence slip resistance, allowing designers and engineers to optimize the outsole designs for improved performance and safety.
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Copyright (c) 2025 Farihur Raiyan, Md. Imrul Kayes Limon, Shirazum Monir Rupak, Muhammad Naimul Hasan, Md. Samsul Arefin (Author)
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